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The present invention relates to a semiconductor device and a method for manufacturing the semiconductor device, and more specifically to a semiconductor device in which one or more semiconductor chips are mounted over a wiring substrate and a method for manufacturing the same.
2. Description of the Related Art
Recently, to reduce the volume and thickness of semiconductor devices, wirings are arranged densely on a wiring substrate such as a tape carrier or a lead frame, and semiconductor chips are electrically connected to the wirings arranged densely.
Such a conventional semiconductor device is explained, referring to FIGS. 16 and 17.
As shown in FIG. 16, a semiconductor element chip 50, two internal wirings 51 and 52, a grounding wiring 53, and a power source wiring 54 are formed in a tape carrier substrate 60, and the semiconductor element chip 50 is mounted over the tape carrier substrate 60 via die bonding. The semiconductor element chip 50 and the tape carrier substrate 60 are electrically connected via the internal wirings 51 and 52, and the grounding wiring 53. Note that only a part of the grounding wiring 53 is shown in the figure, and the remaining grounding wiring 53 is omitted in the figure. The entire internal wirings 51 and 52 are omitted in the figure, since the internal wirings 51 and 52 do not contribute to the explanation.
As shown in FIG. 17, the internal wirings 51 and 52 are formed on a flexible tape carrier substrate 70 made of resin or the like
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