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turbine engine download. Dll turok vc80 wxmsw262u .The present invention relates generally to semiconductor devices and, more particularly, to integrated circuit packages including an enlarged spacing member to be used in a wire-bonded apparatus.
In many semiconductor device applications, a wire-bonded semiconductor device is bonded to a lead frame. The lead frame is typically constructed of Kovar or Invar which are expensive and difficult to cut. Kovar or Invar is also electrically non-conductive which requires soldering or other means of making electrical connections. The lead frame typically includes a number of leads which are wire bonded to bonding pads on a semiconductor chip. The lead frame also includes a number of die paddle terminals which are offset from the leads. This configuration is advantageous in that it provides a xe2x80x9cstand alonexe2x80x9d configuration which is not connected to the die paddle terminals. This allows the lead frame to be removed from the semiconductor device prior to its inclusion in a final package. This is advantageous since it provides a method of reducing the cost of the final package and allows the packaged device to be tested without soldering components to the package.
It is, therefore, desirable to have an improved semiconductor device which provides the stand-alone configuration of the prior art and which can be manufactured without soldering and the expense of high strength materials.
An integrated circuit package including a semiconductor chip and an enlarged spacing member. The enlarged spacing member is located between the semiconductor chip and the lead frame of the integrated circuit package. The enlarged spacing member includes a front surface and a back surface. The front surface has a thickness and the back surface has a thickness which is greater than the thickness of the front surface. The enlarged spacing member is adapted to provide a surface area smaller than the surface area of the semiconductor chip. The enlarged spacing member is adapted to be disposed between the semiconductor chip and the leads of the lead frame. The enlarged spacing member provides an enlarged spacing between the back surface of the enlarged spacing member and the leads of the lead frame. The enlarged spacing member may be located adjacent to one of the leads of the lead frame. In one configuration, the enlarged spacing member may be a planar member which is adhered to the lead frame or an offset member which is offset from one of the leads of the lead frame.Q:
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We have already determined that the appellants have standing to assert a private cause of action against the Commissioner and the Department with respect to G.S. 71-58.
Since the appellants have standing, the issues whether the regulations are a “rule” within the meaning of that phrase in G
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